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Products

SoM, Accelerator & Connectivity

System On Module

Adaptive Edge AI SoM

Edge AI / Physical AI

Adaptive Edge AI SoM

BSP-ready system-on-module designed for Edge AI and Physical AI applications, combining embedded processing with configurable AI acceleration for rapid product development.

Compute: Arm-based processing / FPGA-configurable acceleration

Connectivity: 5G / Wi-Fi 6 / BLE / Ethernet

OS: Linux / RTOS / Android

BSP: Pre-integrated, partner-ready

Applications: Drones, robotics, industrial vision, smart sensing, AI wearables

Accelerator

Reconfigurable Computing

Reconfigurable Compute Accelerator

Reconfigurable Computing

FPGA-based acceleration platform for prototyping, networking, hardware acceleration, and ASIC pre-validation.

FPGA: AMD FPGA ecosystem compatible

Interface: M.2 PCIe / PCIe x4

Use Cases: Algorithm prototyping, networking acceleration, hardware acceleration, ASIC pre-validation

Development: RTL / HLS support

Connectivity

Sensor Hub modules designed to aggregate multi-sensor data at the edge — enabling always-on, low-power sensing with wireless connectivity for Physical AI systems.

Ultra-Low Power Sensor Hub

Always-On BLE Sensing

Ultra-Low Power Sensor Hub

Ultra-low-power sensor hub for always-on, battery-powered sensing. Aggregates environmental and motion sensor data over BLE — purpose-built for long-life IoT deployments.

Core: Ultra-low-power MCU optimized for always-on operation

Connectivity: BLE 5.3 wireless

Sensors: Environmental, motion, IMU interface

Power: Sub-mW standby — coin-cell compatible

Application: Smart buildings, asset tracking, wearable sensing

Application

AI application solutions built on LEAPSWing SoM platforms — ready-to-integrate on-device inference engines.

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On-Device Speech AI

Voice Recognition

On-device voice recognition and speech AI solution. Keyword detection, command recognition, and SLM-based natural language processing — fully offline, privacy-preserving.

Models: Keyword spotting, ASR, SLM (Small Language Model)

Runtime: NPU-optimized speech pipeline — low latency

Input: Microphone array / I2S audio interface

Privacy: On-device processing — no audio transmitted to cloud

Application: Smart toys, service robots, industrial HMI, voice-controlled wearables

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